FEATURES
  • The finest crafted heat spreader with unique trench design
  • High-efficiency aluminum heat spreader
  • 10 layers of circuit board
  • Selected high quality SAMSUNG original IC chips
  • 1.2V~1.4V ultra low working voltage
  • Support Intel XMP 2.0 smart overclocking technology
  • QVL approved by motherboard manufactures in the market
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